(2024)封裝工程技術副理/經理
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- 研發技術行銷類
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- Aug 14, 2024 Post Date
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- 263 Total Views
工作內容：
1. Package design & development for Power SiP/module, Power QFN.
2. Work with BU to define product spec, and optimize process & establish process spec.
職缺需求：
1. 12yr+ working experience
2. Experience with power package/module development
3. Experience with R/L/C & thermal simulation
4. Experience with Bumping & Assembly processes
5. Experience with reliability qualification
6. Self-motivated