(2024)封裝開發技術副理/經理
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- 研發技術行銷類
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- Nov 10, 2024 Post Date
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- 345 Total Views
Thanks for your interest in the (2024)封裝開發技術副理/經理 position.
Unfortunately this position has been closed but you can search our 18 open jobs by clicking here.
職缺需求：
1. 12yr+ working experience
2. Experience with power package/module development
3. Experience with R/L/C & thermal simulation
4. Experience with Bumping & Assembly processes
5. Experience with reliability qualification
6. Self-motivated