🌎
This job posting isn't available in all website languages

(2024)封裝開發技術副理/經理

📁
研發技術行銷類
📅
345 Total Views
Thanks for your interest in the (2024)封裝開發技術副理/經理 position. Unfortunately this position has been closed but you can search our 18 open jobs by clicking here.

職缺需求:

1. 12yr+ working experience
2. Experience with power package/module development
3. Experience with R/L/C & thermal simulation
4. Experience with Bumping & Assembly processes
5. Experience with reliability qualification
6. Self-motivated

Previous Job Searches

My Profile

Create and manage profiles for future opportunities.

Go to Profile

My Submissions

Track your opportunities.

My Submissions

Similar Listings

ChuPei, Taiwan

📁 研發技術行銷類

ChuPei, Taiwan

📁 研發技術行銷類

ChuPei, Taiwan

📁 研發技術行銷類